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Cheetah-640CL TE3

高分辨率水冷型InGaAs摄像机

Cheetah-640CL(TE3)系列可用于微光成像和光谱学

Cheetah-640CL(TE3)系列摄像机是一款 高分辨率、紧凑型红外摄像机, 其配备专用的低噪音 InGaAs探测器阵列,工作范围为 0.9 μm到1.7 μm。

凭借其TE3制冷传感器和水冷型摄像装置, Cheetah-640CL(TE3)系列是一款具备高度灵敏度的摄像机, 可在长积分时间条件下实现 超低暗电流。 其可为您提供 一款出色的测量工具, 以在SWIR范围内进行微光成像, 例如半导体故障分析或 发光光谱应用。

Cheetah- 640CL(TE3)系列随附 软件开发套件, 该套件可允许对各种摄像机设置进行直接读写, 并可轻易与您自己的 CameraLink图像采集系统集成。

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优点和特点

  • 灵活的GUI和SDK
    可为所有摄像机型号提供SDK(软件开发套件)——可提供用于C++、LabView的范例
  • 高量子效率(> 80%)
    量子效率(QE)是探测器将光子转换为电子的能力
  • 高分辨率
    可用于高分辨率SWIR成像的640 x 512像素
  • 低暗电流
    低暗电流可实现更长积分时间和更佳的信噪比
  • 无需LN2制冷
    对于绝大部分应用,SWIR InGaAs摄像机在无需液氮制冷的条件下工作
  • 兼容光谱仪
    这些摄像机配备光谱仪安装孔,使其适用于各种(高)光谱成像应用

设计用于使用

  • 发射显微学
    微电子行业的光学故障定位技术基于微弱的电致发光信号进行
  • 荧光
    荧光是某种吸收光线的物体发射的光线 SWIR摄像机可用于医学应用中的荧光成像
  • 微光成像光谱学:Raman(拉曼)、发射、光致发光、吸光度
    探测在SWIR波长范围的微弱光线
  • R&D (SWIR领域)
    SWIR领域是一个相对未开发的领域,因此可提供较多的研究机会。
  • 半导体故障分析
    基于光子辐射进行半导体组件的故障分析

特征

兼容各种采集卡

Several compatible frame grabbers for CameraLink interface are available

含红外(IR)软件

Xeneth camera control and imaging software is included

触发

External trigger for signal synchronization

开窗模式(ROI模式)

Imaging in a reduced window of interest for increased frame rates

14 bit图像

Digitization: The camera uses a 14 bit ADC

多级制冷

Thermo-electric or Peltier cooling in 3 stages

高灵敏度

Low noise for detection of small signals

兼容光谱仪

Mounting holes available for spectrograph mounting

高分辨率

640x512 pixel resolution

高动态范围

High dynamic range mode available

摄像头规格

Array Specifications

Array Specifications Cheetah-640CL TE3
Detector type InGaAs
Spectral range 0.9 μm to 1.7 μm
Image format 640 (w) x 512 (h) pixels
Pixel pitch 20 μm
Peak Quantum Efficiency (QE) 80%
ROIC noise High gain: 60 e-; low gain: 400 e-
Conversion gain High gain: 20 μV/e-; Low gain: 1.6 μV/e-
Array cooling TE3-cooled
Pixel operability > 99 %

Camera Specifications

Camera Specifications Cheetah-640CL TE3
Lens
Focal length Broad selection of lenses available
Optical interface C-mount - Spectrometer holes
Imaging performance
Maximum frame rate (full frame) 110 Hz
Integration type Snapshot
Min region size Minimum size 32 x 4
Exposure time range up to 20s in HG mode
Analog-to-Digital (ADC) 14 bits
Interfaces
Command and control CameraLink (LVDS voltage levels)
Image acquisition Base CameraLink (14 bit)
Trigger Trigger in and out (3.3 V CMOS)
Power requirements
Power consumption < 4 W without TEC operation; 60 W at maximum cooling
Power supply DC 12 V
Physical characteristics
Camera cooling Water cooling
Ambient operating temperature range 0°C to 50°C
Dimensions (width x height x length) - excluding lens (approximately) 140 x 135 x 90 mm
Weight (excluding lens) 2 kg

配件可供选择范围广泛

镜头和过滤器选项

软件

  • Xeneth SDK
  • Xeneth SDK (optional)
  • Xeneth Labview SDK (optional)

文件

应用笔记
SWIR cameras for timely defect detection ensure higher yields in solar cell production. SWIR cameras for timely defect detection ensure higher yields.
Sensitive infrared InGaAs cameras detect weak electroluminescent radiation emitted by thin-film solar cells Electroluminescence analysis improves the quality of solar cells
Technical documents
ASY-000200B Cheetah CL - TE3 This file contains all the technical documents for the Cheetah TE3.
白皮书
Laser beam profiling and infrared cameras In this white paper, we will address the general need for laser beam profile analysis. Further, we will briefly describe laser beam analysis instruments and give an overview of laser applications, in particular for infrared wavelengths.

小册子

Scientific brochure Cheetah-640CL TE3

World's first InGaAs camera photon emission microscope

Xenics enabled Semicaps to realize the world's first InGaAs camera photon emission microscope in 2004. Since then Xenics and sInfraRed have supported us in our endeavors for better sensitivity and resolution in photon and thermal emission microscopy.

Chua Choon Meng, CEO Semicaps