Xeva-2.35-320

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Xeva-2.35-320

New! Versatile SWIR T2SL camera with response up to 2.35 μm

Superior performance for reliable research

The Xeva-2.35-320 is a compact digital camera operating a T2SL detector array for imaging in the 1.0 to 2.35 μm wavelength range. The camera features a resolution of 320 x 256 pixels with a 30 μm pixel pitch. It outputs 14-bit data and comes in a 100 Hz (USB 2.0)
or 350 Hz (CameraLink) version. 

The camera interfaces to a PC via standard USB 2.0 or CameraLink. Each camera is delivered with a Graphical User Interface (GUI) Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. The camera allows for exposure times from 1 μs to 60 ms in high dynamic range mode (with TE4 cooling).

Through its advanced thermomechanical design, the Xeva-2.35-320 achieves excellent performance levels using a TE4-cooled device operating down to 203K.

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Benefits & features

  • Flexible programming in an open architecture
    SDK (Software Developing Kit) available for all cameras - samples available for C++, LabView, Linux…
  • Spectrometer compatible
    The Xeva-2.35-320 cameras have mounting holes for spectrographs, making them suitable for (hyper)spectral imaging applications
  • Smallest TE4-cooled camera
    The Xeva-2.35-320 is a very small TE4 cooled T2SL camera with low dark current and response up to 2.35 µm
  • High speed SWIR imaging up to 2.35 µm
    The Xeva-2.35-320 allows for high frame rate imaging up to 344 full frames per second - in a reduced window of interest, even higher frame rates are possible
  • Scientific image recording and analysis
    Our standard Xeneth GUI allows for easy recording of images in full (bit) resolution
  • CameraLink and triggering for high speed imaging
    CameraLink interface is suitable for high datarates - triggering can be used for synchronisation at high frame rates

Designed for use in

  • Art inspection
    SWIR photons can penetrate through paint, hence underdrawings can be investigated
  • Hyperspectral imaging
    Combination of spectral imaging and 2D imaging. Our SWIR camera are used for hyperspectral SWIR imaging
  • R&D (SWIR range)
    SWIR range is a relatively unexplored range and hence providing much research opportunities
  • Laser beam profiling
    Laser beam analysis for infrared lasers at, e.g., 1064, 1300 and 1550 nm
  • Semiconductor inspection
    SWIR cameras are able to see through silicon
  • High temperature thermography (in the 300˚ C- 1200˚ C range or up to 2000˚ C)
    SWIR cameras can be used for thermal imaging in the temperature range above 300 degrees C

Features

2 years warranty

Xenics offers standard 2 years warranty

Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available

IR camera software included

Xeneth camera control and imaging software is included

Trigger

External trigger for signal synchronization

Windowing mode

Imaging in a reduced window of interest for increased frame rates

Multi-stage cooling

Thermo-electric or Peltier cooling in 4 stages

High speed

High frame rate imaging at more than 344 fps in full frame

Spectrograph compatible

Mounting holes available for spectrograph mounting

High dynamic range

High dynamic range mode available

Camera specifications

Array Specifications

Array Specifications Xeva-2.35-320
Array type T2SL
Spectral band 1.0 μm to 2.35 μm
Resolution 320 x 256
Pixel pitch 30 μm
Array size W: 9.6 mm; H: 7.68 mm; D: 12.29 mm or 0.48 in
Dark current 20 - 40 x 10x6 e-/s
ROIC noise High gain: 70 electrons; Low gain: 700 electrons
Integration capacitor High gain: 10 fF; Low gain: 210 fF
Full well capacity High gain: 0.17 x 10x6 electrons; Low gain: 3.5 x 10x6 electrons
Array cooling TE4-cooled
Pixel operability > 99 %

Camera Specifications

Camera Specifications Xeva-2.35-320 100 Hz Xeva-2.35-320 350 Hz
Lens
Focal length Broad selection of lenses available
Optical interface C-Mount with filter holder
Imaging performance
Maximum frame rate (full frame) 100 Hz 344 Hz
Window of interest No Minimum 128 x 8
Integration type Snapshot
Exposure time range High gain: 1 μs to > 3 ms; HDR: 1 μs to > 60 ms
Noise High gain: 150 electrons; HDR: 1000 electrons
Gain High gain: 10 electrons/ADU; HDR: 210 electrons/ADU
ADC 14 bit
Interfaces
Camera control USB 2.0
Image acquisition USB 2.0 or CameraLink CameraLink
Trigger TTL levels
Power requirements
Power consumption 7W without cooling; 84 Watt @ maximum cooling
Power supply 24 V
Physical characteristics
Camera cooling Forced convection cooling
Cool-down time Approximately 2 minutes
Ambient operating temperature range 0 to 40 °C
Dimensions (W x H x L mmᵌ) 87 x 115 x 109
Weight camera head +/- 1.8 kg

Broad range of accessories available

Lens & filter options

Software

  • Xeneth
  • Xeneth SDK
  • Xeneth Labview SDK (optional)

Documents

Press Releases
Versatile SWIR T2SL Camera up to 2.35 um The XEVA-2.35-320 TE4 has been announced today as the latest shortwave-infrared image camera of Leuven-based Xenics. The thermo-electrically cooled infrared camera features T2SL infrared detection technology and delivers superb performance in the 1.0 to 2.35 um wavelength region for hyperspectral imaging or laser beam analysis. At Photonics West, Xenics will exhibit in Booth# 834
Extended SWIR T2SL Camera up to 2.35 um Now in Production Xeva-2.35-320 TE4 T2SL shortwave-infrared camera from Xenics delivers superior performance for the most advanced R&D application
Application notes
Hidden structures made visible in art inspection Article about the use of infrared cameras for art inspection. Art restorers and conservators can effectively engage in the examination of valuable art works and their preservation as a cultural heritage.

Brochures

Versatile SWIR T2SL camera with response up to 2.35 μm

World's first InGaAs camera photon emission microscope

Xenics enabled Semicaps to realize the world's first InGaAs camera photon emission microscope in 2004. Since then Xenics and sInfraRed have supported us in our endeavors for better sensitivity and resolution in photon and thermal emission microscopy.

Chua Choon Meng, CEO Semicaps