Xeva-1.7-320 TE3

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Xeva-1.7-320 TE3

Advanced research in SWIR imaging

Stable TE3-cooled SWIR research where every photon counts

In one compact housing, the Xeva-1.7-320 TE3 digital camera combines a thermo-electrically cooled InGaAs detector head and the control and communication electronics.

The Xeva-1.7-320 TE3 unit is available with standard (up to 1.7 μm) InGaAs detector arrays and comes in various speed versions: 60 Hz, 100 Hz and 350 Hz. It allows you to choose the most suitable detector-camera configuration for your specific application.

The camera head interfaces to a PC via standard USB 2.0 or CameraLink.

Each camera is delivered with agraphical user interface Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. The software tools include two-point uniformity correction and bad pixel replacement.

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Benefits & features

  • Spectrometer compatible
    These cameras have mounting holes for spectrographs, making them suitable for (hyper)spectral imaging applications
  • Thermal imaging of hot objects
    SWIR cameras are ideal for thermal imaging of hot metals (> 300 degC)
  • High sensitivity for low-light conditions
    Low noise, low dark current detectors for extended integration times
  • Extending SWIR imaging to the visible
    VISNIR or visible enhanced InGaAs sensors for extended response from 500 to 1700 nm
  • Cooled operation for low light-level imaging
    A cooled SWIR detector has lower dark current and allows for longer integration times
  • Flexible programming in an open architecture
    SDK (Software Developing Kit) available for all cameras - samples available for C++, LabView, Linux…
  • CameraLink and triggering for high speed imaging
    CameraLink interface is suitable for high datarates - triggering can be used for synchronisation at high frame rates
  • Extended coverage from SWIR into the visible range
    VISNIR or visible enhanced InGaAs sensors for extended response from 500 to 1700 nm

Designed for use in

  • Wafer inspection
    SWIR cameras are able to see through silicon
  • R&D (SWIR range)
    SWIR range is a relatively unexplored range and hence providing much research opportunities
  • Hyperspectral imaging
    Combination of spectral imaging and 2D imaging. Our SWIR camera are used for hyperspectral SWIR imaging
  • Low-light-level analysis
    Detection of faint light levels with a cooled SWIR camera
  • Semiconductor inspection
    SWIR cameras are able to see through silicon
  • Solar cell inspection EL/PL
    Inspection techniques for crack inspection or efficiency mapping based on electroluminescence or photoluminescence

Features

Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available

Various lens and filter options

Various options for lenses and filters are available with C-mount interface

IR camera software included

Xeneth camera control and imaging software is included

Trigger

External trigger for signal synchronization

Windowing mode

Imaging in a reduced window of interest for increased frame rates

14 bit image

Digitization: The camera uses a 14 bit ADC

TrueNUC image correction

Non uniformity correction for a wide range of integration times 

Multi-stage cooling

Thermo-electric or Peltier cooling in 3 stages

High sensitivity

Detection of small signals

High dynamic range

High dynamic range mode available

Camera specifications

Array Specifications

Array Specifications Xeva-1.7-320 TE3
Array type InGaAs
Spectral band 0.9 μm to 1.7 μm
Resolution 320 x 256
Pixel pitch 30 μm
Array cooling TE3-cooled
Pixel operability > 99 %

Camera Specifications

Camera Specifications 60 Hz 100 Hz 350 Hz
Lens
Focal length 16 mm f/1.4
Optical interface C-mount - Spectrograph fixation holes
Imaging performance
Maximum frame rate (full frame) 60 Hz 100 Hz 350 Hz
Integration type Snapshot
Integration time range 1 μs - 100 s
Noise level: Low gain 6 AD counts on 14 bit
Noise level: High gain 15 AD counts on 14 bit
S/N ratio: Low gain 68 dB
S/N ratio: High gain 60 dB
ADC 12 bit or 14 bit
Interfaces
Camera control USB 2.0
Image acquisition USB 2.0 or CameraLink
Trigger TTL levels
Graphical User Interface (GUI) Xeneth Advanced
Power requirements
Power consumption < 4 W without TEC operation; Max. 25 W with TE-cooling
Power supply 12 V
Physical characteristics
Camera cooling Forced convection cooling
Ambient operating temperature range 0°C to 50°C
Dimensions (W x H x L mmᵌ) 90 x 110 x 110
Weight camera head +/- 1.8 kg

Broad range of accessories available

Lens & filter options

Software

  • Xeneth
  • Xeneth SDK
  • Xeneth Labview SDK (optional)

Documents

Press Releases
Xenics introduces new Xeva-1.7-320 InGaAs focal plane camera Introducing our Xeva-1.7-320 SWIR InGaAs camera with USB 2.0 interface (2003)
Application notes
Xeva-1.7-320-TE3 for low light level imaging The Xeva-1.7-320-TE3 camera can be used in a wide variety of applications. This application note goes deeper into detail on photon emission microscopy and photon emission analysis.
Hidden structures made visible in art inspection Article about the use of infrared cameras for art inspection. Art restorers and conservators can effectively engage in the examination of valuable art works and their preservation as a cultural heritage.

Brochures

Scientific brochure Xeva-1.7-320 TE3

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