The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm.
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El módulo XSW-640 de Xenics es extremadamente compacto y versátil para una integración fácil y rápida a su configuración de captura de imágenes SWIR.
Algunas aplicaciones OEM típicas incluyen la captura de imágenes infrarrojas para cargas útiles de vehículos tripulados y no tripulados (aéreos y terrestres), visión nocturna, seguridad fronteriza, búsqueda y rescate (SAR) y más.
El módulo de cámara infrarroja XSW/640 detecta radiación infrarroja de onda corta entre 0,4 (opción de 0,4) y 1,7 µm con un amplio rango dinámico, y un amplio rango de temperaturas de funcionamiento.
El sistema de estabilización termoeléctrica (TE) reduce los niveles de corriente oscura y ruido. Junto con la tecnología de procesamiento de imágenes incorporada, usted tendrá el mejor nivel de contrastes y una excelente calidad de imagen.
Contact us for advice, detailed information and quotations.
![]() Compatible con una variedad de digitalizadores de vídeo Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01). |
![]() Compatibilidad con estándar GigE Vision The Gigabit Ethernet interface is compatible to the GigE Vision standard |
![]() SWaP (liviana, pequeña y eficiente) Small volume, low weight and low power consumption for demanding applications |
![]() Disparador External trigger for signal synchronization |
![]() Modo de ventanas Imaging in a reduced window of interest for increased frame rates |
![]() Salida de video Analog video output available |
![]() Corrección de imágenes TrueNUC Non uniformity correction for a wide range of integration times |
![]() Opción VisNIR Visible enhanced InGaAs available (500 - 1700 nm) |
![]() Amplio rango dinámico High dynamic range mode available |
![]() Visión diurna y nocturna The camera can operate under daylight or nighttime conditions |
Array Specifications | XSW-640 | |
Detector type | InGaAs Focal Plan Array (FPA) ROIC with CTIA topology | |
Spectral range | 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm) | |
Image format | 640 (w) x 512 (h) pixels | |
Pixel pitch | 20 μm | |
Readout mode | Integrate Then Read (ITR) | Integrate While Read (IWR) |
Peak Quantum Efficiency (QE) | 80% | 85% |
ROIC noise | High gain: 60 e- | Low gain: 400 e- |
Sensitivity | High gain: 20 μV/e- | Low gain: 1.6 μV/e- |
Dark current | 0.8 x 10⁶ e-/s | |
Integration capacitor | High gain: 6.7 fF | Low gain: 85 fF |
Array cooling | TE1-stabilized | |
Pixel operability | > 99 % |
Module Specifications | XSW-640- Samtec | XSW-640- Analog | XSW-640- CL | XSW-640- GigE | |
Lens | |||||
Focal length | Broad selection of lenses available | ||||
Optical interface | Fixation holes for multiple lens mounts | ||||
Imaging performance | |||||
Maximum frame rate (full frame) | 100 Hz | 25 Hz (PAL), 30 Hz or 9 Hz (NTSC) | 100 Hz | ||
Min region size | Minimum size 32 x 4 | ||||
Integration time range | 1 μs - 40 ms | ||||
Noise level: High gain | 120 e- | ||||
Noise level: Low gain | 400 e- | ||||
Gain level: High gain | 1.28 e-/ADU | ||||
Gain level: Low gain | 16.2 e-/ADU | ||||
On-board image processing | Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities | Up to 4 NUCs, Auto-Gain, Trigger Possibilities | |||
Analog-to-Digital (ADC) | 14 bits | ||||
Interfaces | |||||
Digital output format | BT.601-6/BT.656-5 | - | CameraLink or Xeneth API/SDK | GigE Vision or Xeneth API/SDK | |
Analog output | - | PAL or NTSC | - | ||
Module control | Serial LVCMOS 3 V (XSP) | RS232 (XSP) | CameraLink | GigE Vision | |
Trigger | Trigger in or out (configurable) | ||||
Power requirements | |||||
Power consumption | +/- 2.6 W | 3 W | 2.8 W | 4 W | |
Power supply | DC 12 V | ||||
Physical characteristics | |||||
Shock | 40 g, 11 ms according to MIL-STD810G/MIL-STD883J | ||||
Vibration | 5 g (20 Hz to 2000 Hz) according to MIL-STD810G/MIL-STD883J | ||||
Operating case temperature | -40ºC to 70ºC | ||||
Storage temperature range | -40ºC to 85ºC | ||||
Dimensions (width x height x length) - excluding lens (approximately) | 45 x 45 x 51 mm | 45 x 45 x 55 mm | 45 x 45 x 65 | ||
Weight module | 120 g | 145 g | 129 g | 165 g |
The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm.
The XSW-320 Gated SWIR OEM module operates in the 0.9 to 1.7 μm spectral band and provides extremely short integration times (down to 100 ns).
For stable medium to long range imaging, Xenics presents the stirling cooled XCO-640: an infrared module, based on a cooled MWIR engine with an ult
Xenics at SPIE DSS 2011: high performance infrared OEM modules for easy integration | We offer high resolution infrared OEM modules in both SWIR (XSW-640) as LWIR (XTM-640) (2011) |
T3 XSW H | This file contains all the technical documents for the XSW camera core. |
Secure in Air aprecia el servicio, conocimiento y asesoramiento de nivel profesional de Xenics en la implementación de la cámara Gobi en nuestro proyecto GeoCampro. Nuestro cliente se mostró muy satisfecho con los resultados de las operaciones de búsqueda de defectos (térmicos) en vías férreas.