The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm.
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El módulo térmico XTM-640 de Xenics es un módulo de cámara térmica extremadamente compacto y versátil con una inigualable calidad de imagen y estabilidad para una amplia gama de aplicaciones OEM. Estas aplicaciones incluyen seguridad, visión nocturna, apagado de incendios, reconocimiento aéreo y terrestre y vigilancia.
Gracias a nuestros componentes incorporados de procesamiento de imágenes y control de obturador, podemos garantizarle imágenes térmicas de una uniformidad y nitidez inigualables.
Podrá integrar fácilmente nuestra XTM-640 a su sistema gracias al conector universal Samtec QTE, lo que le provee una salida digital de vídeo o datos digitales sin procesar. Esto le permite tareas de conexión inmediata, adquisición de datos, comando y control.
La densidad de punto pequeña, de 17 μm, permite trabajar con valores de detección, reconocimiento e identificación (DRI) más prolongados en aplicaciones críticas de seguridad.
Contact us for advice, detailed information and quotations.
![]() Compatible con estándar CoaXpress Available with CoaXPress interface |
![]() Compatible con estándar GigE Vision The Gigabit Ethernet interface is compatible to the GigE Vision standard |
![]() Compatible con una variedad de digitalizadores de vídeo Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01). |
![]() SWaP (liviana, pequeña y eficiente) Small volume, low weight and low power consumption for demanding applications |
![]() Disparador External trigger for signal synchronization |
![]() Modo de ventanas Imaging in a reduced window of interest for increased frame rates |
![]() Imagen de 16 bits Digitization: The module uses a 16 bit ADC |
![]() Salida de video Analog video output available |
![]() Alta sensibilidad Low noise equivalent temperature difference (NETD) |
![]() Alta resolución 640x480 pixel resolution |
Array Specifications | XTM-640 | |
Array type | Uncooled microbolometer (a-Si) | |
Spectral band | 8 μm to 14 μm | |
Resolution | 640 x 480 | |
Pixel pitch | 17 μm | |
Thermal sensitivity (NETD) | 55 mK @ 30°C with f/1 lens | |
Array cooling | Uncooled | |
Pixel operability | > 99 % |
Module Specifications | XTM-640-QTE | XTM-640-GigE | XTM-640-CL | XTM-640-Analog |
Lens | ||||
Optical interface | No lens option | Fixation holes for multiple lens mounts | ||
Imaging performance | ||||
Maximum frame rate (full frame) | 50 Hz | 25 Hz (PAL) or 30 Hz (NTSC) | ||
Window of interest | Minimum size 160 x 120 | |||
Integration time range | 1 μs - 80 μs | |||
Shutter | Full control by serial command | |||
Temperature stabilization | No thermoelectric cooling required (TEC-less) | |||
Integration type | Rolling shutter | |||
On-board image processing | Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE | Non-Uniformity Correction, Auto-Offset, Auto-Gain | Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE | |
ADC | 16 bit | |||
Interfaces | ||||
Digital output | BT.601-6/BT.656-5 | GigE Vision or Xeneth API/SDK | CameraLink or Xeneth API/SDK | - |
Analog output | - | PAL or NTSC | ||
Module control | Serial LVCMOS 3 V (XSP) | GigE Vision | CameraLink | RS232 (XSP) |
Trigger | Trigger in or out (configurable) | |||
Power requirements | ||||
Power consumption | 1.65 W | < 4.5 W | < 2 W | |
Power supply | 3.3 V | 12 V | ||
Physical characteristics | ||||
Shock | 40 G, 11 ms according to MIL-STD810G | |||
Vibration | 5 G (20 Hz to 2000 Hz) according to MIL-STD883J | |||
Ambient operating temperature range | -40ºC to 60ºC (industrial components) | |||
Dimensions (W x H x L mmᵌ) | 45 x 45 x 36 | 45 x 45 x 55 | 45 x 45 x 43 | 45 x 45 x 50 |
Weight module | 75 g | 125 g | 84 g | 99 g |
The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm.
The XSW-320 Gated SWIR OEM module operates in the 0.9 to 1.7 μm spectral band and provides extremely short integration times (down to 100 ns).
El módulo XSW-640 de Xenics es extremadamente compacto y versátil para una integración fácil y rápida a su configuración de captura de imágenes SWI
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Xenics at SPIE DSS 2011: high performance infrared OEM modules for easy integration | We offer high resolution infrared OEM modules in both SWIR (XSW-640) as LWIR (XTM-640) (2011) |
Xenics sees strong growth ahead for OEM module business | The OEM module business will grow strongly, especially in the security market. That is why we target the security market with our XenicsCores (2014) |
T3 XTM C | This file contains all the technical documents for the XTM camera core. |
Given the extremely compact size and low weight of the Xenics XS-1.7-320 SWIR camera it was extremely easy to integrate it into our existing optical setup.